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E-beam evaporator uses a magnetically guided and collimated stream of electrons generated by applying high voltage to a filament to melt and vaporize materials in a vacuum chamber.
By first creating a gaseos plasma and then accelerating the ions from this plasma into some source material, target. It is eroded by the arriving ions via energy transfer and is ejected in the form of neutral particles, and then it will be coated by a thin film.
E-beam assisted Sputter
By using cassette in the load-lock chamber, it is possible to deposit kind of 4 patterns without reload the mask. Also using E-beam, we can get a high quality thin films. It is a big advantage of mask-changeable E-beam assisted sputter.
PLD (Pulse Laser Deposition)
A high power pulsed laser beam is focused to a target. This material is vaporized from the target which deposit on a substrate. This process can occur in ultra high vacuum or the process of a background gas, such as oxygen which is commonly used for depositing oxides.
With the use or a syringe pump, the precursor can be fed into needle at a constant and controllable rate. When a high voltage is applied, the drop of solution in needle will become highly electricfied and the induced charges are evenly distributed over the surface.
Process and Measurement
4 Probe Station
UV/ Ozone Surface Treatment
Carrier lifetime measurement
Temperature & Humidity Chamber
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